
Apple-Compatible Adaptive Noise-Cancelling Earphones
Form Factor: In-ear acoustic design with silicone ear tips (S/M/L included). Production First Pass Yield (FPY) $\ge 98.5\%$ in dust-free assembly cleanrooms.
Interface Options: Lightning connector with integrated MFi C94 certified chipset, or USB-C digital audio interface with built-in 24-bit DAC.
Description
Form Factor: In-ear acoustic design with silicone ear tips (S/M/L included). Production First Pass Yield (FPY) $\ge 98.5\%$ in dust-free assembly cleanrooms.
Interface Options: Lightning connector with integrated MFi C94 certified chipset, or USB-C digital audio interface with built-in 24-bit DAC.
Acoustic Architecture: 10mm neodymium magnet dynamic drivers paired with a dual-core DSP feed-forward/feedback hybrid ANC circuit.
Primary B2B Target: OEM/ODM procurement for mobile accessory brand owners, regional distributors, and enterprise telecommunication kit providers.
Product Specifications
|
Specification Parameter |
Technical Data |
Testing Standard / Condition |
|
Acoustic Driver |
10mm Neodymium Magnet Dynamic Driver |
IEC 60268-5 |
|
Frequency Response |
20Hz - 20,000Hz |
Swept sine wave at 100mV input |
|
Impedance |
32 Ohm $\pm 15\%$ at 1kHz |
Precision impedance meter |
|
Total Harmonic Distortion (THD) |
$< 1\%$ at 1kHz, 94dB SPL |
Audio Precision APx515 |
|
ANC Attenuation Depth |
Up to -40dB ambient noise reduction |
ISO 4869-3 acoustic test chamber |
|
Microphone Sensitivity |
-42dB $\pm 3dB$ (MEMS digital microphone) |
ITU-T P.51 artificial ear simulator |
|
Interface Protocol |
Apple MFi C94 Lightning / USB Audio Class 2.0 |
Apple External Accessory Protocol |
|
Operating Temperature |
-10°C to 45°C |
Environmental durability test chamber |
Key Features
Hybrid ANC Architecture: Samples ambient noise at 40,000 times per second, processing dual-core DSP feed-forward and feedback signals to attenuate environmental noise across designated frequency bands.
High-Resolution Digital Decoding: Integrated 24-bit/96kHz digital-to-analog converter (DAC) processes digital bitstreams directly from host devices to maintain source signal integrity.
Hardware-Level Apple Compatibility: Incorporates authorized Apple interface chipsets to ensure native handshake communication with iOS, iPadOS, and macOS host devices without firmware mismatch errors.
Dual-Mic ENC Voice Isolation: Utilizes dual MEMS microphones with beamforming algorithms to separate vocal frequencies from background wind and ambient chatter.
Applications
Mobile Accessory Retail
Supplied to consumer electronics brands and retail chains for consumer distribution.
Corporate Remote Work Kits
Integrated into executive travel and virtual meeting audio packages.
In-Flight Entertainment Bundles
Provisioned for airline amenity programs requiring passive and active noise attenuation.
Battery & Charging
Power Configuration: Bus-powered via host device (Lightning/USB-C wired variants) / 50mAh lithium-ion coin cell per side (wireless active variants).
Playback Endurance: Up to 8 hours continuous playback with ANC enabled; up to 10 hours with ANC disabled (tested at 50% volume).
Battery Lifecycle: Retains $\ge 80\%$ of rated capacity after 500 complete charge-discharge cycles.
Charging Input: USB Type-C input (5V/500mA); a 15-minute charge provides 2 hours of playback.
OEM & ODM Customization
Engineering Capabilities:
- Industrial design (ID) modifications for earbud housing and cable splitters.
- Custom DSP firmware flashing to adjust target EQ curves and ANC filter coefficients.
- Client logo integration via laser engraving or pad printing on housing and packaging.
R&D Support: Dedicated project management, in-house acoustic simulation using B&K head and torso simulators, and 3D CAD prototyping within 72 hours.
Commercial Terms: Standard OEM MOQ starts at 1,000 units per colorway; mass production lead time is 25-30 days following engineering sign-off.
Manufacturing & Quality Control
Facility Infrastructure: 12,000-square-meter ISO 9001 and ISO 14001 certified manufacturing facility featuring dedicated dust-free SMT and assembly cleanrooms.
Production Equipment: Yamaha high-speed SMT placement lines, ASM wire bonders, and automated electro-acoustic test benches.
Inspection Milestones:
- IQC: 100% spectral testing of raw diaphragm materials and integrated circuit chipsets.
- IPQC: Automated optical inspection (AOI) on PCB assemblies and automated audio sweep screening on assembly lines.
- OQC: AQL 1.0 sampling inspection covering drop tests, salt spray corrosion tests, and cable plug insertion durability tests (minimum 5,000 cycles).
Packaging & International Shipping
Standard Packaging: Recyclable paperboard box containing earphones, 3 pairs of silicone ear tips (S/M/L), and multilingual instruction manual.
Master Carton Specifications: 50 units per master carton; carton dimensions: $45 \times 35 \times 30\text{ cm}$; gross weight: $8.5\text{ kg}$.
Logistics Compliance: Palletized shipments secured for sea freight (FOB/CIF) or air express (DHL/FedEx); packaging materials comply with ISTA 3A transit simulation standards and FSC regulations.
FAQ
Q: Do these earphones require proprietary app installations on iOS devices?
A: No. The integrated digital audio chipset communicates natively with iOS, iPadOS, and macOS via standard system audio drivers.
Q: Can we modify the default frequency response curve for our regional market?
A: Yes. ODM projects support custom DSP firmware flashing to meet specific acoustic preference profiles.
Q: What regulatory documentation is provided with the shipment?
A: Standard production units include CE, FCC, RoHS, REACH, and WEEE test reports. MFi compliance documentation is available for authorized brand clients.
Q: What is the procedure for obtaining engineering samples?
A: Standard evaluation samples can be dispatched within 3 business days upon confirmation of shipping details or sample fee settlements.
Request a Quote
To initiate an inquiry or request engineering samples, please provide the following project parameters:
- Project type: OEM White-Label / Custom ODM
- Target order quantity: MOQ
- Interface preference: Lightning / USB-C
- Target destination and incoterms
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